These days, solar cell processing, semiconductor manufacturing, the automotive and medical industries all use laser micromachining systems. A vast range of wavelengths, pulse durations (from femtoseconds to microseconds), and repetition rates (from a single pulse to megahertz) are available in lasers for micromachining. These characteristics enable high resolution micromachining in both lateral and depth dimensions.These techniques enable the creation of extremely precise surface patterns that fall inside the micrometer range. Rapid material heating, melting, and evaporation are necessary for these operations.
Laser Micro Machining System
FEATURES
- Configurations for the laser source: QCW Fiber, UV, IR, Femtosecond, Picosecond, Nanosecond, or Green
- Applications include scribing, etching, dicing, ablation, micro-hole drilling, micro-milling, engraving, and scribing.
- Integration System: You can configure the system with automation to meet your needs.
- 2D planner cutting: with the ability to precisely focus for ceramic cutting, stealth dicing, or dicing
- Micron accuracy: within 1 micron for every 100 mm of trip
- Unique air-bearing slides to increase precision
- rotating Axis: An extra rotating axis can be incorporated into laser microtube machining.
- Closed-loop scanner: for precision parts’ submicron machining
- For microhole drilling, add trepanning starting at 0.25 mm and going up to 1 mm.
SAMPLES
